Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly - Jennie Hwang - Books - Van Nostrand Reinhold Inc.,U.S. - 9780442013530 - September 24, 1992
In case cover and title do not match, the title is correct

Jennie Hwang
Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly New edition

Price
S$ 140
excl. VAT

Ordered from remote warehouse

Expected delivery Jan 9 - 21, 2026
Christmas presents can be returned until 31 January

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.

456 pages, 77 black & white illustrations, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 24, 1992
ISBN13 9780442013530
Publishers Van Nostrand Reinhold Inc.,U.S.
Pages 456
Dimensions 152 × 229 × 24 mm   ·   639 g
Language English  

More by Jennie Hwang

Show all

See all of Jennie Hwang ( e.g. Hardcover Book and Paperback Book )