Solder Joint Reliability: Theory and Applications - John H. Lau - Books - Springer-Verlag New York Inc. - 9781461367437 - February 23, 2014
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Solder Joint Reliability: Theory and Applications Softcover reprint of the original 1st ed. 1991 edition

John H. Lau

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Solder Joint Reliability: Theory and Applications Softcover reprint of the original 1st ed. 1991 edition

New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.


652 pages, 146 black & white illustrations, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released February 23, 2014
ISBN13 9781461367437
Publishers Springer-Verlag New York Inc.
Pages 631
Dimensions 155 × 235 × 34 mm   ·   902 g

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