Manufacturing Challenges in Electronic Packaging - Y C Lee - Books - Springer-Verlag New York Inc. - 9781461376590 - September 25, 2012
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Y C Lee
Manufacturing Challenges in Electronic Packaging Softcover reprint of the original 1st ed. 1998 edition

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About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.

261 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 25, 2012
ISBN13 9781461376590
Publishers Springer-Verlag New York Inc.
Pages 261
Dimensions 155 × 235 × 14 mm   ·   390 g
Language English  
Editor Chen, W.T.
Editor Lee, Y.C.

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