3D Stacked Chips: From Emerging Processes to Heterogeneous Systems - - Books - Springer International Publishing AG - 9783319793054 - May 26, 2018
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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems Softcover reprint of the original 1st ed. 2016 edition

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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

339 pages, 193 Tables, color; 22 Tables, black and white; 157 Illustrations, color; 81 Illustrations

Media Books     Paperback Book   (Book with soft cover and glued back)
Released May 26, 2018
ISBN13 9783319793054
Publishers Springer International Publishing AG
Pages 339
Dimensions 150 × 220 × 10 mm   ·   508 g
Language German  
Editor Elfadel, Ibrahim (Abe) M.
Editor Fettweis, Gerhard

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