IC Interconnect Analysis - Mustafa Celik - Books - Springer-Verlag New York Inc. - 9781402070754 - May 31, 2002
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IC Interconnect Analysis 2002 edition

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As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.


310 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released May 31, 2002
ISBN13 9781402070754
Publishers Springer-Verlag New York Inc.
Pages 310
Dimensions 156 × 234 × 19 mm   ·   671 g
Language English  

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