IC Interconnect Analysis - Mustafa Celik - Books - Springer-Verlag New York Inc. - 9781475776744 - March 23, 2013
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Mustafa Celik
IC Interconnect Analysis Softcover reprint of the original 1st ed. 2002 edition

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As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.

320 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released March 23, 2013
ISBN13 9781475776744
Publishers Springer-Verlag New York Inc.
Pages 310
Dimensions 155 × 235 × 17 mm   ·   453 g
Language English  

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